Production Manufacturing Testing
Electronic assemblies like PCBs, are made from materials with varying thermal expansion rates, temperature changes can cause stress on different components. This stress may lead to cracks in solder joints, potentially causing failures. Thermal cycling is a method used in accelerated life testing to assess the reliability of these joints by simulating temperature fluctuations. This process helps in understanding how products will perform over time under varying thermal conditions.
MPI Thermal’s systems can be integrated into this testing process to provide precise temperature stressing, critical for evaluating product durability and reliability in production.
-60°C / +200°C
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PCB Temperature Cycling Test
The MPI Thermal Air Stream, a versatile and portable device, features an adaptable arm or hose for direct connection to in-line test enclosures, streamlining the testing of Units Under Test (UUTs) during production. This advanced MPI Thermal Air technology enables manufacturers to conduct precise temperature tests right on the production line, eliminating the cumbersome process of removing PCBs for placement in separate test chambers or external thermal cycling systems. The device generates a substantial volume of clean, dry air at a wide temperature range (-80 to +300°C), ensuring rapid and accurate temperature adjustments for single or multiple PCB testing.
PCB Failure Analysis
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Factory Level Testing
Test Engineers can use ThermalAir system equipment and our GGlass Capp Test Chambers to bring their Printed Circuit Boards (PCBs) to temperature from -80°C to +225°C. Our systems generate a hot and cold thermal air stream directly on the parts that require thermal testing.
The excessive difference in coefficients of thermal expansion between the components and the printed board cause strain in solder and embedded copper structures to induce a fatigue or failure. Temperature changes, not just component shapes or quality, in electronics assemblies are a critical part of the fatigue prediction. Thermal Cycling Testing is used to to evaluate and predict Fatigue Life of PCBs. This thermal cycle test is repeated ranging from a high temperature testing ranges to a low temperature testing ranges to accurately predict the fatigue life cycle of a Printed Circuit Board through heat stress analysis.Â
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ThermalAir TA-Series Temperature Test Systems
ThermalAir stream temperature forcing systems are used in a variety of industrial electronic test applications. Thermal cycling and temperature characterization of your parts in industries such as automotive, telecom, aerospace, medical, sensors, RF microwave and other electronic temperature test applications is what the ThermalAir TA-Series of temperature test equipment provides for many product market segments.
Our small thermal test chambers used in combination with the ThermalAir TA-5000 products have a temperature range from -100°C to +225°C without the use of LN2 or Co2.
Production Line Electronic Test
Electronic failures occur due to thermally induced stresses and strains caused by excessive differences in coefficients of thermal expansion (CTE) across materials in PCB’s. As temperature of an electronic systems and component rises, the heat loss increases. Temperatures may be high enough to significantly decrease the life of components, causing devices to fail. Thermal cycling tests are critical to ensure product reliability in PCB’s, electronics, and materials.
All types of electronic and non-electronic devices require temperature cycling and thermal shock test to make sure industrial products are unaffected by changes in temperature and other harsh environmental stress conditions.
The ThermalAir TA-5000 Series brings controlled temperature right to the test.
Download the Datasheets
Performance
Temperature Change Rate (in seconds)
Production Manufacturing
Electronic Assemblies (PCB’s) are manufactured from a wide range of materials with various coefficients of thermal expansion. As these assemblies experience temperature changes, the CTE (Coefficient of Thermal Expansion) mismatches place shear strains on different components in the PCB assemblies resulting in cracks in solder joints that can propagate resulting in failure. Thermal Cycling is used in accelerated life testing of joints to determine product reliability.  Â
Thermal Cycle PCB’s, Componets, and Assemblies
MPI Thermal temperature inducing equipment is portable and can easily be moved from one test station to another. Fiber Optic Component manufacturers can use our ThermalAir TA-5000 system to quickly bring their parts to temperature right at the test location.
Thermal shock testing has long been the accepted method to check the reliability of plated-through holes and solder joint connections and to determine the reliability of electrical interconnects in PCB’s. Reliability testing has become increasingly important to the electronics and PCB industries.
Thermal Cycle Testing of PWBs
Reliability testing of printed wire boards (PWBs) by thermal cycling offers the ability to compare relative survivability through assembly and reliability in the end use environment. Thermal cycle testing of PWBs is generally focused on the failure of the conductive circuits and interconnections. Testing is achieved by thermal cycling a representative coupon with the same constructions and design attributes as the associated PWB.
The ThermalAir TA-5000 products have a wide range of temperature test capabilities. Bench top -40°C to +80°C applications to temperature cycling -100°C to +300°C environmental test. The TA-5000 is used for temperature testing in engineering product development test labs and production test floors for semiconductor IC’c,  non-electronic components, PWB’s, and other parts and assemblies.
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ThermalAir TA-Series Temperature Test Systems
ThermalAir stream temperature forcing systems are used in a variety of industrial electronic test applications. Thermal cycling and temperature characterization of your parts in industries such as automotive, telecom, aerospace, medical, sensors, RF microwave and other electronic temperature test applications is what the ThermalAir TA-Series of temperature test equipment provides for many product market segments.
Our small thermal test chambers used in combination with the ThermalAir TA-5000 products have a temperature range from -100°C to +225°C without the use of LN2 or Co2.
Thermal Cycle Testing of PWBs
Reliability testing of printed wire boards (PWBs) by thermal cycling offers the ability to compare relative survivability through assembly and reliability in the end use environment. Thermal cycle testing of PWBs is generally focused on the failure of the conductive circuits and interconnections. Testing is achieved by thermal cycling a representative coupon with the same constructions and design attributes as the associated PWB.
The ThermalAir TA-5000 products have a wide range of temperature test capabilities. Bench top -40°C to +80°C applications to temperature cycling -100°C to +300°C environmental test. The TA-5000 is used for temperature testing in engineering product development test labs and production test floors for semiconductor IC’c,  non-electronic components, PWB’s, and other parts and assemblies.
ThermalAir Test Chambers & Accessories
The ThermalAir series of temperature testing and thermal cycling test systems have a wide range of accessories that are attached to the ThermalAir Stream Arm and Flex Hose located at the end of Thermal Head output gas nozzles.
They incorporate an intuitive full funtion for the ThermalAir users with the flexibility to accurately test in a variety of ways at the thermal test workstation.
The TA-5000A and TA-3000A series can also be used with an Thermal End Effector adaptors interfaced to the end of Thermal Head Arm and Stand, designed to adapt to the end users device under test. The exact use of this device depends on the users thermal test application.
Customize Your Temperature Testing Application
From the Lab to the Production Line
The ThermalAir series of temperature testing and thermal cycling test systems and their accessories can be customized for your applications, optimizing your production environment’s inline testing.
The TA-5000A and TA-3000A series can also be used with the Thermal Hood Test Enclosure.
Be sure to ask a representive about Custom Size Test Chambers.