Environmental Temperature Test​ing Telecommunications

Temperature Conditioning – Reliability Testing –  Reliability Testing –  Accelerated Stress Testing – Accelerated Life Testing – Accelerated Stress Testing

Reliability Testing – Thermal Profiling – HALT/HASS Chambers –  Temperature Profiling – Accelerated Stress Testing – Temperature Conditioning

Thermal Profiling – Accelerated Life Testing –  Thermal Profiling –  Accelerated Life Testing – Thermal Profiling – Thermal Profiling

Temperature Conditioning – Accelerated Life Testing –  Temperature Conditioning –  Reliability Testing – Fast Temperature Testing – Accelerated Stress Testing

Thermal Test SFP

Temperature Cycling Telecommunication Systems

Thermal Cycling Test Systems

Thermal Test Systems

Temperature Test Chambers

Temperature Test Telecommunications Components

Accelerated Temperature Cycling

Temperature Inducing Systems

Environmental Temperature Test

Temperature Conditioning Transceivers

Temperature Inducing Telecom Components

Environmental Temperature Test

Thermal Inducing SFP Modules
Cold Testing SFP Modules
Temperature Cycling Transceivers
Temperature Cycling 5G Devices

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Telecommunications Test Applications
Telecommunications Test Applications

Temperature forcing systems and environmental test chambers are part of the final temperature test process. These environmental tests help with failure analysis by thermally stressing the device throughout the design and manufacturing process to assure product quality and reliability.

Temperature forcing systems and environmental test chambers are part of the final temperature test process. These environmental tests help with failure analysis by thermally stressing the device throughout the design and manufacturing process to assure product quality and reliability.

Small Temperature Forcing System
TA-5000A w/ Glass Cap
TA-5000A w/ Glass Cap
-80°C / +225°C
-80°C / +225°C
TA-1000
TA-1000
-25°C / +200°C
-25°C / +200°C
TA-3000A w/ Glass Cap
TA-3000A w/ Glass Cap
-65°C / +225°C
-60°C / +225°C

-100°C / +300°C

-100°C / +300°C

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Telecommunications Test Applications
Telecommunications Test Applications

Temperature forcing systems and environmental test chambers are part of the final temperature test process. These environmental tests help with failure analysis by thermally stressing the device throughout the design and manufacturing process to assure product quality and reliability.

Temperature forcing systems and environmental test chambers are part of the final temperature test process. These environmental tests help with failure analysis by thermally stressing the device throughout the design and manufacturing process to assure product quality and reliability.

Small Temperature Forcing System
TA-5000A w/ Glass Cap
TA-5000A w/ Glass Cap
-80°C / +225°C
-80°C / +225°C
TA-1000
TA-1000
-25°C / +200°C
-25°C / +200°C
TA-3000A w/ Glass Cap
TA-3000A w/ Glass Cap
-65°C / +225°C
-60°C / +225°C

-100°C / +300°C

-100°C / +300°C

HALT/HASS – Accelerated Life Testing –  Temperature Conditioning –  Temperature Conditioning – Accelerated Life Testing – HALT/HASS Testing

ThermalAir Stream Temperature Forcing Systems Hot and Cold Testing

 

MPI Thermal cutting-edge technology allows testing with temperatures speeding to super-fast ramp rates and temperature cycling for MIL-STD -55°C to +125°C.

MPI ThermalAir systems can ramp in seconds not minutes. This new thermal test technology gives the end user the ability to easily control the ramp rate speed with one touch temperature set point functions.

The ThermalAir systems bring the temperature hot and cold directly to your electronic and non-electronic parts. This enables you to bring the temperature to the test station in the engineering test lab and manufacturing test on the production line.

Temperature Forcing System

5th Generation (5G) Telecommunications Uses Gigahertz (GHz) Wavelengths

The Telecommunications Industry promises fast and unlimited mobile internet access with the next generation of 5G technologies. This 5G technology is designed to provide faster downloads, streaming movies, wireless virtual reality, in addition to being the platform for the Internet of Things. 5G will mainly be used for more immersive entertainment and surveillance with much greater public exposure, especially in “Smart Cities”.  Military uses have also been discussed. This 5th generation (5G) systems use high frequency with Gigahertz (GHz) wavelengths in the millimeter range.

Since 5G technology is more and more exposed to outdoor outside environments, manufacturers of these high speed 5G devices for automotive, military, defense, commercial, industrial and consumer 5G electronics require temperature conditioning, thermal cycle test and other temperature testing parameters are needed in product development.

In the Telecommunications Industry, electronic components and equipment must be tested to confirm that everything functions properly as a system. In the telecommunications manufacturing  process, individual components, modules, and other components need be temperature tested to assure reliability.  Each piece needs to be designed to work when exposed to harsh temperature environments.

Reliability Testing – HALT/HASS –  Thermal Profiling –  Reliability Testing – Thermal Conditioning – Accelerated Life Testing

ThermalAir Temperature Test Systems

When localized thermal test and accurate temperatures are needed, the ThermalAir products can meet requirements that most environmental chambers cannot. Our ThermalAir products provide uniform methods to generate hot and cold temperature for telecom and RF microwave components from -55°C to +125°C.

ThermalAir Temperature Test Systems are used as part of the test for telecom equipment destined for certain networks in outside environments that need to be thermal tested at hot and cold temperatures. This is to assure telecom systems, microwave RF and other telecommunication parts work when exposed to outside environments.

ThermalAir Temperature Forcing Systems with Localized Test Chambers Applications Used

 

  • Life Test
  • Infant Mortality
  • Product Design
  • Temperature Conditioning 
  • Incoming Inspection
  • Thermal Profiling
  • Thermal Stress
  • Thermal Cycling

     

    Accelerated Life Testing – Accelerated Stress Testing –  Reliability Testing –  Temperature Conditioning – Thermal Conditioning – Thermal Profiling

    MPI Thermal Temperature Testing Products

    Telecommunication components and hardware need environmental temperature, vibration, and humidity testing. Thermal cycling, temperature conditioning, and environmental stressing of devices is considered vital to reliability testing and durability to meet user’s operating requirements in the field of use.

    Whether it’s thermal profiling, temperature cycling, thermal shock, or temperature conditioning, ThermalAir Temperature Test Systems can help with your temperature requirements.

    Temperature Cycling Test System

    ThermalAir Thermal Test Systems for Fiber Optic Component Manufacturers

    The design challenges go well beyond simply delivering processing power and high-speed data transfer. Design engineers must also safely manage heat generated by those processes in the confines of tight vehicle packaging requirements, as well as ambient and cold temperature fluctuations, while adhering to stringent safety and reliability standards of the automotive industry.

    ThermalAir Systems for Automotive Temperature Test Applications

    • One system fits all temperature ranges -80°C to +225°C
    • Plug in anywhere 200 to 25OVAC, 20amp, 50/60Hz
    • Up to 24 SCFM continuous airflow capacity Hot & Cold
    • Fastest temperature ramp rates without the use of LN2 or CO2
    • Systems are easily moved for sharing between workstations or testers.
    TA1000 Temperature Cycling Test System | Thermal Cycling Test | Temperature Cycling Test Equipment |Thermal Cycling

    Environmental Stress Testing

    Environmental stress conditions such as radiation exposure, temperature extremes, vibration, and dirt encountered by the military, on factory floors, and under the hoods of automobiles, these semiconductor devices need to keep working. To assure quality and reliability of electronic devices, semiconductor manufacturers need to simulate harsh environments during the engineering and production test stage. This is why the MPI Thermal TA-5000 Series ThermalAir temperature test products are part of the test.

    Accelerated Stress Testing – Reliability Testing –  Accelerated Stress Testing –  Accelerated Stress Testing – Accelerated Life Testing – HALT/HASS Testing

    ThermalAir Systems for Fiber Optic Components, Parts, and Accessories

    The Telecommunications Industry promises fast and unlimited mobile internet access with the next generation of 5G technologies. This 5G technology is designed to provide faster downloads, streaming movies, wireless virtual reality, in addition to being the platform for the Internet of Things. 5G will mainly be used for more immersive entertainment and surveillance with much greater public exposure, especially in “Smart Cities”.  Military uses have also been discussed. This 5th generation (5G) systems use high frequency with Gigahertz (GHz) wavelengths in the millimeter range.

    Temperature Forcing System

    MPI ThermalAir temperature forcing systems provide a direct thermal stream of clean dry hot and cold air directly to the part that needs to be thermal tested. In the lab or on the production floor, ThermalAir Series provide unparalleled thermal stress testing  capabilities for scientist and engineers.

    The ThermalAir system allows you to generate very precise controlled temperature for simulation test in Thermal Shock, Temperature Conditioning, Environmental Stress Screening, Temperature Cycling and more. Thermal test processes can be accomplished with our ThermalAir system. Ramp, Cycle, Dwell and Soak times are fully programmable with a touch of a button.

    Onscreen User Manual
    Datalog Screen

    Easy Icon at a touch
    Cycle Screen
    Main Operator Screen
    Dual Touch Screens
    previous arrow
    next arrow

    Temperature Cycling Test Systems

    Product engineers and test engineers in the lab and on the semiconductor production floor use and share the ThermalAir temperature forcing systems to bring their devices to temperature ranges from -55°C to +125°C. ThermalAir environmental temperature test systems generate a hot and cold air stream directly on the device under test (DUT).

    ThermalAir TA-5000B with Environmental Test Chamber

    Precision Temperature Forcing Systems use a direct temperature-controlled stream of hot or cold air to provide a precise thermal environment for temperature testing, conditioning and cycling of electronic and non-electronic assemblies and sub-systems. The ThermalAir Temperature test System enables the test. This allows you to perform temperature simulation tests in situ, at a specific location, at your tester station, test bench or directly on the unit under test.

    Temperature Conditioning – Thermal Profiling – Accelerated Stress Testing – Temperature Profiling – Fast Temperature Testing – Accelerated Life Testing

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