TA5000A
In semiconductor manufacturing, engineers design integrated circuits IC devices with temperature in mind. MPI Thermal systems are used in the semiconductor manufacturing process from product development in the product engineering labs to final assembly & test on the production floor.
In semiconductor manufacturing, engineers design integrated circuits IC devices with temperature in mind. MPI Thermal systems are used in the semiconductor manufacturing process from product development in the product engineering labs to final assembly & test on the production floor.
-100°C / +300°C
-100°C / +300°C
TA5000A
In semiconductor manufacturing, engineers design integrated circuits IC devices with temperature in mind. MPI Thermal systems are used in the semiconductor manufacturing process from product development in the product engineering labs to final assembly & test on the production floor.
In semiconductor manufacturing, engineers design integrated circuits IC devices with temperature in mind. MPI Thermal systems are used in the semiconductor manufacturing process from product development in the product engineering labs to final assembly & test on the production floor.
-100°C / +300°C
-100°C / +300°C
In the manufacturing of semiconductors electronic components for harsh environments, the IC package assembly and test stages of engineering and production include burn-in, electronic hot and cold testing at temperature, and other environmental test simulations. These semiconductor devices and electronics, once put in real world applications, can get exposed to extreme environmental conditions.
Product engineers and test engineers in the lab and on the semiconductor production floor use and share the ThermalAir temperature forcing systems to bring their devices to temperature ranges from -55°C to +125°C. ThermalAir environmental temperature test systems generate a hot and cold air stream directly on the device under test (DUT).
The ThermalAir TA-5000 has a temperature range from -80°C to +225°C without the use of LN2 or CO2. Our portable self-contained thermal inducing systems only need to be plugged in. This lets you easily temperature test your electronic semiconductor IC devices, BGA’s, & CSPs.
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Accelerated Stress Testing
Thermal Cycling Tests are used to to evaluate and predict Fatigue Life of Semiconductor IC packages. These thermal cycle tests are repeated, cycling from high temperature testing ranges to a low temperature testing ranges to accurately predict the fatigue life cycle of a device through heat stress and failure analysis.
ThermalAir thermal cycling test systems perform at the the mil-spec thermal testing range of -55°C to +125°C (actual test range -100°C to +300°C), with fast thermal cycling test capabilities in just seconds. Control temperature transition times, set ramp, soak, and cycle with a touch.
This is why the MPI Thermal TA-5000 Series ThermalAir Thermal Cycle Test Systems are used for accurate temperature testing and are an integral part of the semiconductor testing, manufacturing, and IC packaging process.
Thermal Cycling BGAs – Thermal Characterization – Accelerated Life Testing – Accelerated Life Testing – Thermal Profiling – Thermal Cycling Test
Accelerated Life Testing BGAs & CSPs
Our Precision Thermal Stress Test Systems use a direct temperature-controlled stream of hot or cold air to provide a precise test environment for thermal stress testing BGAs & CSPs, thermal profiling and thermal cycling tests of electronic and non-electronic assemblies and sub-systems. The ThermalAir Temperature system enables an accurate thermal cycling test for BGA package testing, allowing you to perform temperature simulation tests in situ, at a specific location, at your tester station, test bench, or directly on the unit under test. Our portable self-contained thermal inducing systems only need to be plugged in and you’re ready for test, easily allowing fatigue life test of electronic semiconductor IC devices.
Some Applications
- Thermal Shock
- Back-End Test
- Incoming Inspection
- IC Handler Verification
- Functional Test
- Cooling the IC while Stress Full Cycle
- Failure Analysis
- Final Test
And More…
Thermal Characterization – Thermal Characterization – IC Package Test – Failure Analysis Testing – Failure Analysis Testing – Temperature Testing BGA
Reliability Testing BGAs & CSPs
Precision Temperature Forcing Systems use a direct temperature-controlled stream of hot or cold air to provide a precise thermal environment for thermal shock, temperature testing, conditioning and cycling of electronic and non-electronic assemblies and sub-systems. The ThermalAir Temperature system enables the test. This allows you to perform temperature simulation tests in situ, at a specific location, at your tester station, test bench or directly on the unit under test.
Temperature Testing Semicondcutor ICs
In the manufacturing of semiconductors electronic components for harsh environments, the IC package assembly and test stages of engineering and production include burn-in, electronic hot and cold testing at temperature, and other environmental test simulations. These semiconductor devices and electronics, once put in real world applications, can get exposed to extreme environmental conditions.
The ThermalAir TA-5000 has a temperature range from -80°C to +225°C without the use of LN2 or CO2. Our portable self-contained thermal inducing systems only need to be plugged in. This lets you easily temperature test your electronic semiconductor IC devices.
Environmental Stress Testing
Environmental stress conditions such as radiation exposure, temperature extremes, vibration, and dirt encountered by the military, on factory floors, and under the hoods of automobiles, these semiconductor devices need to keep working. To assure quality and reliability of electronic devices, semiconductor manufacturers need to simulate harsh environments during the engineering and production test stage. This is why the MPI Thermal TA-5000 Series ThermalAir temperature test products are part of the test.
Some Applications
- Product Engineering
- Back-End Test
- Incoming Inspection
- IC Handler Verification
- Functional Test
- Cooling the IC while Stress Full Cycle
- Failure Analysis
- Final Test
And More…
Temperature Forcing System
Precision Temperature Forcing Systems use a direct temperature-controlled stream of hot or cold air to provide a precise thermal environment for temperature testing, conditioning and cycling of electronic and non-electronic assemblies and sub-systems. The ThermalAir Temperature system enables the test. This allows you to perform temperature simulation tests in situ, at a specific location, at your tester station, test bench or directly on the unit under test.
