PCB Temperature Test
Electronic Assemblies (PCB’s) are manufactured from a wide range of materials with various coefficients of thermal expansion. As these assemblies experience temperature changes, the CTE (Coefficient of Thermal Expansion) mismatches place shear strains on different components in the PCB assemblies resulting in cracks in solder joints that can propagate resulting in failure. Thermal Cycling is used in accelerated life testing of joints to determine product reliability.  Â
-80°C / +225°C
-100°C / +300°C
PCB Reliability Testing
Printed Circuit Boards (PCBs) need to go through a series of extensive tests and inspections at each step of the manufacturing process to assure the products meets or exceed specifications.
Reliability decreases exponentially in electronic components due to heat problems. ThermalAir series of thermal testing cycling test systems helps manufacturers design ICs, chips, and PCBs for superior thermal performance.
Electronics Temperature Test Parts/Components
The excessive difference in coefficients of thermal expansion between the components and the printed board cause strain in solder and embedded copper structures to induce a fatigue or failure. Temperature changes, not just component shapes or quality, in electronics assemblies are a critical part of the fatigue prediction. Thermal Cycling Testing is used to to evaluate and predict Fatigue Life of PCBs. This thermal cycle test is repeated ranging from a high temperature testing ranges to a low temperature testing ranges to accurately predict the fatigue life cycle of a Printed Circuit Board through heat stress analysis.Â
 PCB Thermal Shock –  Environmental Stress Testing – Temperature Test Electronics – Temperature Forcing Systems – Temperature Inducing Electronics
PCB Thermal Shock Test
The thermal shock test serves a crucial role in ensuring the reliability and robustness of PCB circuit board welding. During the engineering development phase, it’s instrumental in uncovering design flaws and process inadequacies, paving the way for optimized product development. As products approach finalization or enter the design appraisal phase, the test becomes vital in assessing their resilience to abrupt temperature changes.Â
Thermal Cycle Testing of PWBs
Reliability testing of printed wire boards (PWBs) by thermal cycling offers the ability to compare relative survivability through assembly and reliability in the end use environment. Thermal cycle testing of PWBs is generally focused on the failure of the conductive circuits and interconnections. Testing is achieved by thermal cycling a representative coupon with the same constructions and design attributes as the associated PWB.
 Thermal Test Electronics –  Thermal Test Systems – Temperature Test Microelectronics –  Thermal Test Microelectronics – Environmental Test Microelectronics
Thermal Cycle PCB’s, Componets, and Parts
The ThermalAir TA-5000 Series can provide accurate temperature stimuli so the electronic component manufacturers can design, develop and produce highly reliable quality parts that meet the demanding standards of today’s electronic technologies.
All types of electronic and non-electronic devices require temperature cycling and thermal shock test to make sure industrial products are unaffected by changes in temperature and other harsh environmental stress conditions.
Temperature Cycling Test System
MPI ThermalAir temperature cycling test systems provide a direct thermal stream of clean dry hot and cold air directly to the part that needs to be thermal tested. In the lab or on the production floor, ThermalAir Series provide unparalleled thermal stress testing  capabilities for scientist and engineers.
The ThermalAir system allows you to generate very precise controlled temperature for simulation test in Thermal Shock, Temperature Conditioning, Stress Screening, Temperature Cycling and more. Thermal test processes can be accomplished with our ThermalAir system. Ramp, Cycle, Dwell and Soak times are fully programmable with a touch of a button.