Semiconductor Industry & Application
In semiconductor manufacturing, engineers design integrated circuits IC devices with temperature in mind. MPI Thermal systems are used in the semiconductor manufacturing process from product development in the product engineering labs to final assembly & test on the production floor.
-80°C / +225°C
-100°C / +300°C
Temperature Testing Semicondcutor ICs
In the manufacturing of semiconductors electronic components for harsh environments, the IC package assembly and test stages of engineering and production include burn-in, electronic hot and cold testing at temperature, and other environmental test simulations. These semiconductor devices and electronics, once put in real world applications, can get exposed to extreme environmental conditions.
The ThermalAir TA-5000 has a temperature range from -80°C to +225°C without the use of LN2 or CO2. Our portable self-contained thermal inducing systems only need to be plugged in. This lets you easily temperature test your electronic semiconductor IC devices.
Thermal Characterization of IC Packages
Thermal Cycling of packaged semiconductor devices is critical for the performance and reliability of IC applications. Thermal management, thermal resistance, and temperature characterization must be taken into account to ensure product reliability. All Semiconductor ICs generate heat when power is applied to them. To maintain the device’s junction temperature below the maximum allowed, adequate heat flow from the semiconductor IC through the package to the ambient is critical.
Temperature Range Testing – Temperature Forcing Systems – Temperature Testing Chamber – Temperature Conditioning – Test Chambers
Controlled Temperature Cycling Test PCBs, MEMs, MCMs, BGAs, CSP assemblies
MPI ThermalAir Test Systems Brings Precise Temperature testing capabilities directly to the parts, components, PCBs, MEMs, MCMs, BGAs, CSP assemblies, and electronics. Our flexible, mobile thermal air forcing systems and benchtop test chambers provide a stream of hot or cold air directly to the test. ThermaAir provides engineers and researchers an accurate temperature controlled test environment capable of performing rapid temperature cycling in ther lab or on the production floor.
Environmental Stress Testing
Environmental stress conditions such as radiation exposure, temperature extremes, vibration, and dirt encountered by the military, on factory floors, and under the hoods of automobiles, these semiconductor devices need to keep working. To assure quality and reliability of electronic devices, semiconductor manufacturers need to simulate harsh environments during the engineering and production test stage. This is why the MPI Thermal TA-5000 Series ThermalAir temperature test products are part of the test.
Thermal Shock – IC Temperature Forcing – Environmental Testing – Thermal Shock – Temperature Cycling Chambers
Some Applications
- Product Engineering
- Back-End Test
- Incoming Inspection
- IC Handler Verification
- Functional Test
- Cooling the IC while Stress Full Cycle
- Failure Analysis
- Final Test
And More…
Temperature Forcing System
Precision Temperature Forcing Systems use a direct temperature-controlled stream of hot or cold air to provide a precise thermal environment for temperature testing, conditioning and cycling of electronic and non-electronic assemblies and sub-systems. The ThermalAir Temperature system enables the test. This allows you to perform temperature simulation tests in situ, at a specific location, at your tester station, test bench or directly on the unit under test.
Temperature Cycling Test – Thermal Test Equipment – Semiconductor Temperature Test – Temperature Conditioning – Temperature Characterization
Temperature Cycling Test Systems
Product engineers and test engineers in the lab and on the semiconductor production floor use and share the ThermalAir temperature forcing systems to bring their devices to temperature ranges from -55°C to +125°C. ThermalAir environmental temperature test systems generate a hot and cold air stream directly on the device under test (DUT).
ThermalAir TA-5000B with Environmental Test Chamber
Precision Temperature Forcing Systems use a direct temperature-controlled stream of hot or cold air to provide a precise thermal environment for temperature testing, conditioning and cycling of electronic and non-electronic assemblies and sub-systems. The ThermalAir Temperature system enables the test. This allows you to perform temperature simulation tests in situ, at a specific location, at your tester station, test bench or directly on the unit under test.
