Thermal Inducing SFP Modules

Temperature Cycling Telecommunication Systems

Thermal Test SFP

Thermal Cycling Test Transceivers

Thermal Test Systems

Environmental Test Telecommunications

Temperature Test Telecommunications Components

Accelerated Temperature Cycling 

Temperature Inducing Modules

Environmental Temperature Test

Temperature Conditioning Transceivers

Temperature Inducing Telecom Components

Environmental Temperature Testing

Thermal Inducing SFP Modules
Cold Testing SFP Modules
Temperature Cycling Transceivers
Temperature Cycling 5G Devices

Telecommunications Test Applications

 

Temperature forcing systems and environmental test chambers are part of the final temperature test process. These environmental tests help with failure analysis by thermally stressing the device throughout the design and manufacturing process to assure product quality and reliability.

-80°C / +225°C

-100°C / +300°C

ThermalAir Thermal Test Systems for Fiber Optic Component Manufacturers

The design challenges go well beyond simply delivering processing power and high-speed data transfer. Design engineers must also safely manage heat generated by those processes in the confines of tight vehicle packaging requirements, as well as ambient and cold temperature fluctuations, while adhering to stringent safety and reliability standards of the automotive industry.

ThermalAir Systems for Automotive Temperature Test Applications

  • One system fits all temperature ranges -80°C to +225°C
  • Plug in anywhere 200 to 25OVAC, 20amp, 50/60Hz
  • Up to 24 SCFM continuous airflow capacity Hot & Cold
  • Fastest temperature ramp rates without the use of LN2 or CO2
  • Systems are easily moved for sharing between workstations or testers.
TA1000 Temperature Cycling Test System | Thermal Cycling Test | Temperature Cycling Test Equipment |Thermal Cycling

Environmental Stress Testing

Environmental stress conditions such as radiation exposure, temperature extremes, vibration, and dirt encountered by the military, on factory floors, and under the hoods of automobiles, these semiconductor devices need to keep working. To assure quality and reliability of electronic devices, semiconductor manufacturers need to simulate harsh environments during the engineering and production test stage. This is why the MPI Thermal TA-5000 Series ThermalAir temperature test products are part of the test.

Accelerated Stress Testing – Temperature Conditioning – HALT/HASS Chambers –  Accelerated Stress Testing – Reliability Testing – Temperature Conditioning

ThermalAir Systems for Fiber Optic Components, Parts, and Accessories

The Telecommunications Industry promises fast and unlimited mobile internet access with the next generation of 5G technologies. This 5G technology is designed to provide faster downloads, streaming movies, wireless virtual reality, in addition to being the platform for the Internet of Things. 5G will mainly be used for more immersive entertainment and surveillance with much greater public exposure, especially in “Smart Cities”.  Military uses have also been discussed. This 5th generation (5G) systems use high frequency with Gigahertz (GHz) wavelengths in the millimeter range.

Temperature Forcing System

MPI ThermalAir temperature forcing systems provide a direct thermal stream of clean dry hot and cold air directly to the part that needs to be thermal tested. In the lab or on the production floor, ThermalAir Series provide unparalleled thermal stress testing  capabilities for scientist and engineers.

The ThermalAir system allows you to generate very precise controlled temperature for simulation test in Thermal Shock, Temperature Conditioning, Stress Screening, Temperature Cycling and more. Thermal test processes can be accomplished with our ThermalAir system. Ramp, Cycle, Dwell and Soak times are fully programmable with a touch of a button.

Onscreen User Manual
Datalog Screen

Easy Icon at a touch
Cycle Screen
Main Operator Screen
Dual Touch Screens
previous arrow
next arrow

Temperature Cycling Test Systems

Product engineers and test engineers in the lab and on the semiconductor production floor use and share the ThermalAir temperature forcing systems to bring their devices to temperature ranges from -55°C to +125°C. ThermalAir environmental temperature test systems generate a hot and cold air stream directly on the device under test (DUT).

ThermalAir TA-5000B with Environmental Test Chamber

Precision Temperature Forcing Systems use a direct temperature-controlled stream of hot or cold air to provide a precise thermal environment for temperature testing, conditioning and cycling of electronic and non-electronic assemblies and sub-systems. The ThermalAir Temperature system enables the test. This allows you to perform temperature simulation tests in situ, at a specific location, at your tester station, test bench or directly on the unit under test.

Reliability Testing – Reliability Testing – Reliability Testing – Temperature Profiling – Thermal Profiling – Reliability Testing