ThermalAir TA-3000A
ThermalAir Series Temperature Forcing System
-65°C to +225°C
The ThermalAir TA-3000 high capacity thermal air stream system is used for temperature testing, fast thermal cycling, and device temperature characterization of components, hybrids, modules, PCBs, and other electronic and non-electronic assemblies at precise temperature from -65°C to +225°C. Compact! Plus Performance!
Rapid Thermal Cycling
This Unique Under the Bench configuration is designed to save floor space by installing the TA-3000U right under the test bench.
In the High-Tech Industry such as in semiconductor manufacturing, floor space is at a premium. When floor space is a concern in small engineering labs or production test floors the TA-3000U answers the call.
The ThermalAir TA-3000 high capacity thermal air stream system is used for temperature testing, fast thermal cycling, and device temperature characterization of components, hybrids, modules, PCBs, and other electronic and non-electronic assemblies at precise temperature from -65°C to +225°C. Compact! Plus Performance!
Benchtop Test Chamber – Thermal Shock – Temperature Test Chambers – Thermal Test Systems – Test Chambers
Feature and Advantages
- Ultra Cold Temperatures are maintained at 50Hz or 60Hz.
- The System’s Touch Screen lets operator control temperature settings, ramp and cycle right at user test bench workstation.
- Plug-in Anywhere from 200 to 250VAC. No need for user voltage re-configuration when system moved to different locations.
- USB for thermal file management and data logging.
- A separate temperature controlled dry air purge for keeping surrounding test area frost free operation during long test times at extrerme cold temperatures.
- Two User Control Modes – Standard Operator & Temperature Cycle (Temp Cycle, Ramp & Soak).
- User Interface and Operations – Remote Control Compatible
- Modes for existing user test programs.- Center Control Color Touch Screen Display
- IEEE-488.2(GPIB), USB, Ethernet, Serial, LXI
- Intranet via LAN
- LabVIEW drivers
Temperature Forcing Systems – Temperature Cycling Test – Temperature Testing Chamber – Thermal Test Equipment – Temperature Testing Chamber
ThermalAir Color Touch Screen GUI
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MAIN Users Defined Preset Temperature Settings
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CYCLE Hot/Cold Temperature Cycle User Profiles
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SETUP Save/Load Temperature Parameters
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UTILITIES Configuration, Calibration & Diagnostics
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REVIEW Real-time & History – Full Temperature Graphs
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DATALOG Chart Time & Temperature to USB
Click to Enlarge
Benchtop Test Chamber – Small Test Chamber – Temperature Testing Chamber – Thermal Test Equipment – Temperature Testing Chamber
ThermalAir TA-3000U Modular Design for Efficient Factory Space
With factory and production test floor space at a premium, the TA-3000U was engineered with a modular, space-conscious architecture specifically for today’s test environments where every square foot counts. The “U” stands for Under-the-Bench, reflecting its low-profile design that seamlessly fits beneath lab test bench or out of the way on the production test floor. freeing up critical surface area in and around the workstations test area. This configuration is ideal where thermal testing is needed while saving floor space. Whether you’re performing hot and cold thermal cycling, characterization, or functional test at temperature, the TA-3000U lets you reclaim valuable workspace without compromising system performance.
With the cost of semiconductor test/fab floor space (especially cleanroom and production areas) being extremely high — significantly more expensive than typical industrial space — because of the extreme environmental control and infrastructure required for semiconductor processes, the TA-3000U is designed to be modular allowing for more effecient and customizable set up, in the lab and on the production test floor.