PCB Temperature Test
Electronic Assemblies (PCB’s) are manufactured from a wide range of materials with various coefficients of thermal expansion. As these assemblies experience temperature changes, the CTE (Coefficient of Thermal Expansion) mismatches place shear strains on different components in the PCB assemblies resulting in cracks in solder joints that can propagate resulting in failure. Thermal Cycling is used in accelerated life testing of joints to determine product reliability.  Â
-60°C / +200°C
Thermal Test Electronics – Temperature Cycling Electronics – Temperature Testing Electronics – Thermal Test Systems – Temperature Inducing Electronics
PCB Reliability Test
Printed Circuit Boards (PCBs) need to go through a series of extensive tests and inspections at each step of the manufacturing process to assure the products meets or exceed specifications.
Reliability decreases exponentially in electronic components due to heat problems. ThermalAir series of thermal testing cycling test systems helps manufacturers design ICs, chips, and PCBs for superior thermal performance.
Electronics Thermal Test – Thermal Testing Electronics – Temperature Testing Chamber – Temperature Cycling Test – Temperature Inducing Electronics
Electronics Temperature Test Parts/Components
Test Engineers can use ThermalAir system equipment and our test chambers to bring their Printed Circuit Boards (PCBs) to temperature from -60°C to +200°C. Our systems generate a hot and cold thermal air stream directly on the parts that require thermal testing.
The excessive difference in coefficients of thermal expansion between the components and the printed board cause strain in solder and embedded copper structures to induce a fatigue or failure. Temperature changes, not just component shapes or quality, in electronics assemblies are a critical part of the fatigue prediction. Thermal Cycling Testing is used to to evaluate and predict Fatigue Life of PCBs. This thermal cycle test is repeated ranging from a high temperature testing ranges to a low temperature testing ranges to accurately predict the fatigue life cycle of a Printed Circuit Board through heat stress analysis.Â
Thermal Cycling Test – Temperature Cycling Electronics – Thermal Cycling Electronics – Environmental Testing Electronics – Temperature Inducing Electronics
ThermalAir TA-Series Temperature Test Systems
ThermalAir stream temperature forcing systems are used in a variety of industrial electronic test applications. Thermal cycling and temperature characterization of your parts in industries such as automotive, telecom, aerospace, medical, sensors, RF microwave and other electronic temperature test applications is what the ThermalAir TA-Series of temperature test equipment provides for many product market segments.
Our small thermal test chambers used in combination with the ThermalAir TA-5000 products have a temperature range from -60°C to +200°C without the use of LN2 or Co2.
PCB Thermal Shock Test
The thermal shock test serves a crucial role in ensuring the reliability and robustness of PCB circuit board welding. During the engineering development phase, it’s instrumental in uncovering design flaws and process inadequacies, paving the way for optimized product development. As products approach finalization or enter the design appraisal phase, the test becomes vital in assessing their resilience to abrupt temperature changes.Â
This evaluation is fundamental in guiding decisions related to design finalization and green-lighting mass production. Furthermore, in its capacity as an environmental stress screening tool, the thermal shock test is key in weeding out early product failures, thereby enhancing the overall quality and dependability of the final product.
All types of electronic and non-electronic devices require temperature cycling and thermal shock test to make sure industrial products are unaffected by changes in temperature and other harsh environmental stress conditions.
Thermal Cycle PCB’s, Componets, and Assemblies
MPI Thermal temperature inducing equipment is portable and can easily be moved from one test station to another. Fiber Optic Component manufacturers can use our ThermalAir TA-5000 system to quickly bring their parts to temperature right at the test location.
Thermal shock testing has long been the accepted method to check the reliability of plated-through holes and solder joint connections and to determine the reliability of electrical interconnects in PCB’s. Reliability testing has become increasingly important to the electronics and PCB industries.
Thermal Cycle Testing of PWBs
Reliability testing of printed wire boards (PWBs) by thermal cycling offers the ability to compare relative survivability through assembly and reliability in the end use environment. Thermal cycle testing of PWBs is generally focused on the failure of the conductive circuits and interconnections. Testing is achieved by thermal cycling a representative coupon with the same constructions and design attributes as the associated PWB.
The ThermalAir TA-5000 products have a wide range of temperature test capabilities. Bench top -60°C to +200-°C applications to temperature cycling -100°C to +300°C environmental test. The TA-5000 is used for temperature testing in engineering product development test labs and production test floors for semiconductor IC’c,  non-electronic components, PWB’s, and other parts and assemblies.
ThermalAir Test Chambers & Accessories
The ThermalAir series of temperature testing and thermal cycling test systems have a wide range of accessories that are attached to the ThermalAir Stream Arm and Flex Hose located at the end of Thermal Head output gas nozzles.
They incorporate an intuitive full funtion for the ThermalAir users with the flexibility to accurately test in a variety of ways at the thermal test workstation.
The TA-5000A and TA-3000A series can also be used with an Thermal End Effector adaptors interfaced to the end of Thermal Head Arm and Stand, designed to adapt to the end users device under test. The exact use of this device depends on the users thermal test application.
Customize Your Temperature Testing Application
ThermalAir Custom Test Chamber Sizes Available
The ThermalAir series of temperature testing and thermal cycling test systems and their accessories can be customized for your applications, optimizing your production environment’s inline testing. MPI Thermal’s temperature test systems are highly adaptable, capable of accommodating a wide range of sizes and configurations for devices and components. Understanding these subtleties helps in choosing a system that matches your particular testing scenario, offering a comprehensive solution for all your testing requirements.
The TA-5000A and TA-3000A series can also be used with the Thermal Hood Test Enclosure.
Be sure to ask a representive about Custom Size Test Chambers.
